D1 Chip Introduction
【The Light of Domestic Semiconductors】【Allwinner Technology & Ali Pinto Joint Development】
【RISC-V open source instruction set】【World's first chip with Pinto C906 core】
D1 is Allwinner Technology's first chip based on RISC-V instruction set, integrated with Ali Pinto's 64-bit C906 core, supports RVV, 1GHz main frequency, and can support Linux, RTOS and other systems. It also supports up to 4K H.265/H.264 decoding, a built-in HiFi4 DSP and up to 2GB DDR3 external connection, which can be applied to various fields such as smart city, smart car, smart business display, smart home appliance, smart office and research and education.
To facilitate developers' learning and partners' solution evaluation, Allwinner Online has customized a highly integrated dedicated development board based on the D1 chip, code name: Nezha!
For more information, please see:D1 Development Board - Nezha
Ali Pingtou Ge xuantie C906 main core, 64bit RISC-V instruction set 32 KB I-cache + 32 KB D-cache
HiFi4 DSP 600MHz 32 KB I-cache + 32 KB D-cache 64 KB I-ram + 64 KB D-ram
DDR2/DDR3, up to 2 GB SD3.0/eMMC 5.0, SPI Nor/Nand Flash
Video decoding - H.265 up to [email protected], or [email protected] - H.264 up to [email protected], or 4K[email protected] - MPEG-1/2/4, JPEG, VC1 up to [email protected] Video encoding - JPEG/MJPEG up to [email protected] - Supports input picture scaler up/down
RGB LCD output interface up to 1920 x [email protected] Dual link LVDS interface up to 1920 x [email protected] 4-lane MIPI DSI interface up to 1920 x [email protected] HDMI V1.4 output interface up to [email protected] CVBS OUT interface, supporting NTSC and PAL format
8-bit parallel CSI interface CVBS IN interface, supporting NTSC and PAL format
2 DACs and 3 ADCs Analog audio interfaces: MICIN1P/N, MICIN2P/N, MICIN3P/N, FMINL/R, LINEINL/R, LINEOUTLP/N, LINEOUTRP/N, HPOUTL/R Digital audio interfaces: I2S/PCM, DMIC, OWA IN/OUT
USB2.0 OTG, USB2.0 Host SDIO 3.0, SPI x 2, UART x 6, TWI x 4 PWM (8-ch), GPADC (2-ch), LRADC (1-ch), TPADC (4-ch), IR TX&RX 10/100/1000M EMAC with RMII and RGMII interfaces
LFBGA BGA13*13/0.35/0.65mm,337 PINS Chip process 22nm